Department of Electrical Engineering and Automation

Electronics integration and reliability

The research in the Electronics Integration and Reliability (EILB) is focused on new materials, three-dimensional (3D) integration and reliability of electronics and microelectromechanical systems (MEMS). The material concepts and technologies we develop will be of central importance in the realization of almost any ubiquitous electronics and miniaturized smart systems in applications from minimally invasive surgery to autonomous driving.
Electronics integration and reliability

EILB group is located in Micronova ( and uses the cutting-edge infrastructure of OtaNano, providing centralized access to advanced nanofabrication, nanomicroscopy and low-noise measurement facilities. In addition, the group has its own reliability testing laboratory including equipment for environmental, mechanical and thermomechanical testing, and uses different modeling tools to anticipate and rationalize reliability performance of heterogeneous integration in micro- and nanosystems.

The intensive co-operation of EILB with numerous semiconductor, electronics and MEMS manufacturing companies facilitates the comprehensive training of our students to combine scientific knowledge with industry-relevant technological advancement.

Examples of our recent research from large international Public-Private-Partnership projects are ENIAC Lab4MEMS II, ECSEL Informed and ECSEL POSITION II.

ENIAC Lab4MEMS II, Micro-Optical MEMS, micro-mirrors and pico-projectors: One of the main objectives of this project was to develop a fully integrated process for wafer level MEMS packaging utilizing Poly-Si through silicon via (TSV) capped MEMS devices. Sc. “vias before bonding” capping process and contact metallizations for Poly-Si TSVs (see Fig. below) were developed together with VTT and industrial partners (Okmetic and Murata Finland). Then the process integration was demonstrated by using piezoelectrically driven MEMS actuators.

Fig. 1a
Fig. 1a)
Fig. 1b
Fig. 1b)

Figure 1a) and 1b). SEM micrographs of the fully integrated MEMS package including Al redistribution layer, Cap wafer poly-Si TSVs, and wafer level SLID bonding providing electrical interconnection between the device and cap wafer as indicated by the SEM-EDS elemental analysis

ECSEL InForMed, An Integrated Pilot Line for Micro-Fabricated Medical Devices: The project covered development, assembly and fabrication of smart catheters and other minimally invasive diagnostic and therapeutic instruments and tools. The focus of the research in EILB was in development of advanced bonded silicon-on-insulator (SOI) structures for flexible sensor assemblies.

ECSEL POSITION II Towards the next generation of smart catheters and implants: Miniaturized MEMS sensors and transducers using advanced materials are studied in this project to realize smart catheters. EILB group studies the structural stability of different piezo-films, alternative piezo/electrode material stacks and Piezoelectric Micromachined Ultrasonic Transducers (PMUT) devices.

Recent doctoral dissertations from the EILB group include “Solid-liquid interdiffusion bonding for MEMS device integration” by A. Rautiainen and “Quality, Microstructural Refinement and Stability of Atomic-layer-deposited Aluminum Nitride and Aluminum Oxide Films” by M. Broas

Our teaching is part of the major Translational Engineering of AEE program, and includes e.g. the following courses:

  • ELEC-E8712 Design for Reliability
  • ELEC-E8713 Materials and Microsystems Integration
  • ELEC-E8714 Sustainable Electronics
  • ELEC-E8711 Materials Compatibility

For more information, please contact prof. Mervi Paulasto-Kröckel ([email protected]), senior lecturer, Dr. Vesa Vuorinen ([email protected]) or doctoral candidate Mr. Glenn Ross ([email protected]).


Latest publications

Where is silicon based MEMS heading to?

Mervi Paulasto-Kröckel, Markku Tilli, Glenn Ross, Heikki Kuisma 2020 Handbook of Silicon Based MEMS Materials and Technologies (Third Edition)

Metalorganic chemical vapor deposition of aluminum nitride on vertical surfaces

Elmeri Österlund, Sami Suihkonen, Glenn Ross, Altti Torkkeli, Heikki Kuisma, Mervi Paulasto-Kröckel 2020 Journal of Crystal Growth

In-situ annealing characterization of atomic-layer-deposited Al2O3 in N2 , H2 and vacuum atmospheres

Mikael Broas, Jori Lemettinen, Timo Sajavaara, Markku Tilli, Vesa Vuorinen, Sami Suihkonen, Mervi Paulasto-Kröckel 2019 Thin Solid Films

Development of Working Life Competencies in a Project Course for Master Students at Aalto University

Robert Millar, Kirsti Keltikangas, Paulo Pinho, Vesa Vuorinen, Pekka Forsman, Anouar Belahcen, Jorma Kyyrä 2019 YLIOPISTOPEDAGOGIIKKA

Inorganic particulate matter in the lung tissue of idiopathic pulmonary fibrosis patients reflects population density and fine particle levels

Kati Mäkelä, Hely Ollila, Eva Sutinen, Vesa Vuorinen, Emilia Peltola, Riitta Kaarteenaho, Marjukka Myllärniemi 2019 ANNALS OF DIAGNOSTIC PATHOLOGY

The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation

Glenn Ross, Per Malmberg, Vesa Vuorinen, Mervi Paulasto-Kröckel 2019 ACS Applied Electronic Materials

Atomic layer deposition of piezoelectric aluminum nitride thin films

Elmeri Österlund, Heli Seppänen, Mervi Paulasto-Kröckel 2019

Mechanical properties and reliability of aluminum nitride thin films

Elmeri Österlund, Jere Kinnunen, Ville Rontu, Altti Torkkeli, Mervi Paulasto-Kröckel 2019 Journal of Alloys and Compounds

The effect of platinum contact metallization on Cu/Sn bonding

Antti Rautiainen, Glenn Ross, Vesa Vuorinen, Hongqun Dong, Mervi Paulasto-Kröckel 2018 Journal of Materials Science: Materials in Electronics

Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding

Antti Rautiainen, Vesa Vuorinen, Hannele Heikkinen, Mervi Paulasto-Krockel 2018 IEEE Transactions on Components, Packaging and Manufacturing Technology
More information on our research in the Research database.
Research database
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