Shenyi Liu
Doctoral Researcher
Doctoral Researcher
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Email
shenyi.liu@aalto.fi
Research groups
- Electronics Integration and Reliability, Doctoral Researcher
Publications
Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging
Fahimeh Emadi, Shenyi Liu, Vesa Vuorinen, Mervi Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Early detection of wire bond degradation in IGBT modules using on-chip junction temperature sensor
Joonas Leppanen, Atte Hoffren, Tapio Leppanen, Eeli Kerttula, Shenyi Liu, Vesa Vuorinen, Mervi Paulasto-Kröckel
2025
IEEE Transactions on Power Electronics
Comparison and Optimization of SLID Bonding for Die-attach on Various Substrate Types in Power Module Packaging Applications
Shenyi Liu, Vesa Vuorinen, Jannis Schuh, Jurgen Albrecht, Mervi Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability
Fahimeh Emadi, Vesa Vuorinen, Shenyi Liu, Mervi Paulasto-Krockel
2024
IEEE Transactions on Components, Packaging and Manufacturing Technology
Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Krockel
2024
IEEE Transactions on Power Electronics
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
F. Emadi, Shenyi Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel
2022
ASDAM 2022 - Proceedings