Glenn Ross
Academy Research Fellow
Academy Research Fellow
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Email
[email protected]
Honors and awards
Vuoden sytyttäjä - Motivator of the year 2017 - 2018
For excellent and dedicated guidance in advising students' project work.
Palkinto tai huomionosoitus urasta
Sähkötekniikan ja automaation laitos
Apr 2018
Top 3 Student Session Winners
Impurities in electroplated Cu and void formation in Cu-Sn micro-connects
Palkinto tai huomionosoitus tuotoksesta
Sähkötekniikan ja automaation laitos
Jan 2017
Research groups
- Electronics Integration and Reliability, Akatemiatutkija
Publications
Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication
Kristina Bespalova, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces
Tarmo Nieminen, Tomi Koskinen, Vladimir Kornienko, Glenn Ross, Mervi Paulasto-Kröckel
2024
In-Plane AlN-based Actuator: Toward a New Generation of Piezoelectric MEMS
Kristina Bespalova, Tarmo Nieminen, Artem Gabrelian, Glenn Ross, Mervi Paulasto-Kröckel
2023
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel
2023
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope
Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2023
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel
2023
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel
2022
Unlocking the Potential of Piezoelectric Films Grown on Vertical Surfaces for Inertial MEMS
Gabrelian Gabrelian, Glenn Ross, Kristina Bespalova, Mervi Paulasto-Kröckel
2022