Glenn Ross
Academy Research Fellow
Academy Research Fellow
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Contact information
Email
[email protected]
Honors and awards
Vuoden sytyttäjä - Motivator of the year 2017 - 2018
For excellent and dedicated guidance in advising students' project work.
Palkinto tai huomionosoitus urasta
Sähkötekniikan ja automaation laitos
Apr 2018
Top 3 Student Session Winners
Impurities in electroplated Cu and void formation in Cu-Sn micro-connects
Palkinto tai huomionosoitus tuotoksesta
Sähkötekniikan ja automaation laitos
Jan 2017
Research groups
- Electronics Integration and Reliability, Akatemiatutkija
Publications
Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication
Kristina Bespalova, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Advanced Electronic Materials
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Materials Characterization
In-Plane AlN-based Actuator: Toward a New Generation of Piezoelectric MEMS
Kristina Bespalova, Tarmo Nieminen, Artem Gabrelian, Glenn Ross, Mervi Paulasto-Kröckel
2023
Advanced Electronic Materials
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel
2023
Materials Science and Engineering: A
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Scripta Materialia
Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope
Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2023
Micromachines
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel
2023
IEEE Transactions on Electron Devices
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel
2022
Journal of Alloys and Compounds
Unlocking the Potential of Piezoelectric Films Grown on Vertical Surfaces for Inertial MEMS
Gabrelian Gabrelian, Glenn Ross, Kristina Bespalova, Mervi Paulasto-Kröckel
2022
Materials Today Communications
Aluminium corrosion in power semiconductor devices
J. Leppänen, J. Ingman, J. H. Peters, M. Hanf, Robert Ross, G. Koopmans, J. Jormanainen, A. Forsström, G. Ross, N. Kaminski, V. Vuorinen
2022
Microelectronics Reliability