Mervi Paulasto-Kröckel
Professor
Professor
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Honors and awards
Best paper award
Award or honor granted for a specific work
Department of Electrical Engineering and Automation
Oct 2000
JVST A Best ALD Paper Award
Award for paper "Atomic layer deposition of AlN using atomic layer annealing—Towards high-quality AlN on vertical sidewalls, by Elmeri Österlund, Heli Seppänen, Kristina Bespalova, Ville Miikkulainen and Mervi Paulasto-Kröckel, JVST A 39, 032403 (2021)"
Award or honor granted for a specific work
Department of Chemistry and Materials Science
Jun 2021
Research groups
- Electronics Integration and Reliability
Publications
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Scripta Materialia
Joint International Master in Smart Systems Integrated Solutions
Knut E. Aasmundtveit, Changhai Wang, Márta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc P.Y. Desmulliez, Ferenc Ender, Vesa Vuorinen
2022
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel
2022
Journal of Alloys and Compounds
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
F. Emadi, S. Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel
2022
ASDAM 2022 - Proceedings
Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer
F. Emadi, V. Vuorinen, S. Mertin, Kim Widell, M. Paulasto-Kröckel
2022
Journal of Alloys and Compounds
Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging
Fahimeh Emadi, Vesa Vuorinen, Mervi Paulasto-Kröckel
2022
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings
Unlocking the Potential of Piezoelectric Films Grown on Vertical Surfaces for Inertial MEMS
Gabrelian Gabrelian, Glenn Ross, Kristina Bespalova, Mervi Paulasto-Kröckel
2022
Materials Today Communications
Finite element simulation of solid-liquid interdiffusion bonding process
Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel
2022
IEEE Transactions on Components, Packaging and Manufacturing Technology
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel
2022
IEEE Transactions on Electron Devices
Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding
Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Kröckel, Tobias Wernicke, Anneliese Pönninger
2022
IEEE Transactions on Components, Packaging and Manufacturing Technology