Mervi Paulasto-Kröckel
Professor
Professor
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Honors and awards
Best paper award
Award or honor granted for a specific work
Department of Electrical Engineering and Automation
Oct 2000
JVST A Best ALD Paper Award
Award for paper "Atomic layer deposition of AlN using atomic layer annealing—Towards high-quality AlN on vertical sidewalls, by Elmeri Österlund, Heli Seppänen, Kristina Bespalova, Ville Miikkulainen and Mervi Paulasto-Kröckel, JVST A 39, 032403 (2021)"
Award or honor granted for a specific work
Department of Chemistry and Materials Science
Jun 2021
Research groups
- Electronics Integration and Reliability
Publications
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Scripta Materialia
Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope
Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2023
Micromachines
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel
2023
IEEE Transactions on Electron Devices
Joint International Master in Smart Systems Integrated Solutions
Knut E. Aasmundtveit, Changhai Wang, Márta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc P.Y. Desmulliez, Ferenc Ender, Vesa Vuorinen
2022
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel
2022
Journal of Alloys and Compounds
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
F. Emadi, S. Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel
2022
ASDAM 2022 - Proceedings
Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer
F. Emadi, V. Vuorinen, S. Mertin, Kim Widell, M. Paulasto-Kröckel
2022
Journal of Alloys and Compounds
Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging
Fahimeh Emadi, Vesa Vuorinen, Mervi Paulasto-Kröckel
2022
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings
Unlocking the Potential of Piezoelectric Films Grown on Vertical Surfaces for Inertial MEMS
Gabrelian Gabrelian, Glenn Ross, Kristina Bespalova, Mervi Paulasto-Kröckel
2022
Materials Today Communications
Finite element simulation of solid-liquid interdiffusion bonding process
Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel
2022
IEEE Transactions on Components, Packaging and Manufacturing Technology