Mervi Paulasto-Kröckel

T410 Dept. Electrical Engineering and Automation
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Honors and awards

JVST A Best ALD Paper Award

Award for paper "Atomic layer deposition of AlN using atomic layer annealing—Towards high-quality AlN on vertical sidewalls, by Elmeri Österlund, Heli Seppänen, Kristina Bespalova, Ville Miikkulainen and Mervi Paulasto-Kröckel, JVST A 39, 032403 (2021)"
Award or honor granted for a specific work Department of Chemistry and Materials Science Jun 2021

Best paper award

Award or honor granted for a specific work Department of Electrical Engineering and Automation Oct 2000

Research groups

  • Electronics Integration and Reliability


Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication

Kristina Bespalova, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel 2024

Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects

Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel 2024

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel 2024

Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces

Tarmo Nieminen, Tomi Koskinen, Vladimir Kornienko, Glenn Ross, Mervi Paulasto-Kröckel 2024

In-Plane AlN-based Actuator: Toward a New Generation of Piezoelectric MEMS

Kristina Bespalova, Tarmo Nieminen, Artem Gabrelian, Glenn Ross, Mervi Paulasto-Kröckel 2023

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2023

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel 2023

Joint International Master in Smart Systems Integrated Solutions

Knut E. Aasmundtveit, Changhai Wang, Márta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc P.Y. Desmulliez, Ferenc Ender, Vesa Vuorinen 2022 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings