Mervi Paulasto-Kröckel

Professor
Professor
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...

Contact information

Phone number
+358505113197

Honors and awards

Best paper award

Award or honor granted for a specific work Department of Electrical Engineering and Automation Oct 2000

JVST A Best ALD Paper Award

Award for paper "Atomic layer deposition of AlN using atomic layer annealing—Towards high-quality AlN on vertical sidewalls, by Elmeri Österlund, Heli Seppänen, Kristina Bespalova, Ville Miikkulainen and Mervi Paulasto-Kröckel, JVST A 39, 032403 (2021)"
Award or honor granted for a specific work Department of Chemistry and Materials Science Jun 2021

Research groups

  • Electronics Integration and Reliability

Publications

Finite element simulation of solid-liquid interdiffusion bonding process

Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel 2022 IEEE Transactions on Components, Packaging and Manufacturing Technology

Joint International Master in Smart Systems Integrated Solutions

Knut E. Aasmundtveit, Changhai Wang, Marta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc Desmulliez, Ferenc Ender, Vesa Vuorinen 2021 Proceedings of Smart Systems Integration Conference, SSI 2021

Characterization of AlScN-Based Multilayer Systems for Piezoelectric Micromachined Ultrasound Transducer (pMUT) Fabrication

Kristina Bespalova, Elmeri österlund, Glenn Ross, Mervi Paulasto-Kröckel, Abhilash Thanniyil Sebastian, Cyril Baby Karuthedath, Stefan Mertin, Tuomas Pensala 2021 Journal of Microelectromechanical Systems

Calculation of Phase Diagrams and First-Principles Study of Germanium Impacts on Phosphorus Distribution in Czochralski Silicon

Hongqun Dong, Xiaoma Tao, Mervi Paulasto-Kröckel 2021 Journal of Electronic Materials

Low-temperature Metal Bonding for Optical Device Packaging

Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel 2021 Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021

Aluminum Nitride to Silicon Direct Bonding for an Alternative Silicon-On-Insulator Platform

Jani Kaaos, Glenn Ross, Mervi Paulasto-Kröckel 2021 ACS applied materials & interfaces

A humidity-induced novel failure mechanism in power semiconductor diodes

J. Leppänen, G. Ross, V. Vuorinen, J. Ingman, J. Jormanainen, M. Paulasto-Kröckel 2021 Microelectronics Reliability

Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding

Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Kröckel, Tobias Wernicke, Anneliese Pönninger 2021 IEEE Transactions on Components, Packaging and Manufacturing Technology

Wafer Level Solid Liquid Interdiffusion Bonding

V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel 2021 Journal of Electronic Materials