Department of Electrical Engineering and Automation
Mervi Paulasto-Kröckel
Professor (Associate Professor)
Contact information
Email
[email protected]
Postal address
Otakaari 7 B
Mobile phone
+358505113197
Full researcher profile
https://research.aalto.fi/...
Honors and awards
Best paper award
Research groups
Electronics Integration and Reliability
Publications
Department of Electrical Engineering and Automation, Department of Electronics and Nanoengineering, Markku Sopanen Group, Electronics Integration and Reliability
In-situ annealing characterization of atomic-layer-deposited Al2O3 in N2 , H2 and vacuum atmospheres
Publishing year: 2019
Thin Solid Films
School common, ELEC, Electronics Integration and Reliability, Department of Electrical Engineering and Automation, Harri Lipsanen Group, Department of Electronics and Nanoengineering
Atomic layer deposition of piezoelectric aluminum nitride thin films
Publishing year: 2019
Department of Electrical Engineering and Automation, Microfabrication, Department of Chemistry and Materials Science, Electronics Integration and Reliability
Mechanical properties and reliability of aluminum nitride thin films
Publishing year: 2019
Journal of Alloys and Compounds
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation
Publishing year: 2019
ACS Applied Electronic Materials
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS
Publishing year: 2018
Proceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
The effect of platinum contact metallization on Cu/Sn bonding
Publishing year: 2018
Journal of Materials Science: Materials in Electronics
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding
Publishing year: 2018
IEEE Transactions on Components, Packaging and Manufacturing Technology
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
Stability of Piezoelectric Al1-xScxN Thin Films
Publishing year: 2018
Microfabrication, Department of Chemistry and Materials Science, Department of Electronics and Nanoengineering, Department of Electrical Engineering and Automation, Harri Lipsanen Group, Electronics Integration and Reliability
Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma
Publishing year: 2018
JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY A