Mervi Paulasto-Kröckel
Department of Electrical Engineering and Automation

Mervi Paulasto-Kröckel

Professor (Associate Professor)

Contact information

Email
[email protected]
Postal address
Otakaari 7 B
Mobile phone
+358505113197
Full researcher profile
https://research.aalto.fi/...

Honors and awards

Award or honor granted for a specific work
Department of Electrical Engineering and Automation
Oct 2000

Best paper award

Research groups

Electronics Integration and Reliability

Publications

Department of Electrical Engineering and Automation, Department of Electronics and Nanoengineering, Markku Sopanen Group, Electronics Integration and Reliability

In-situ annealing characterization of atomic-layer-deposited Al2O3 in N2 , H2 and vacuum atmospheres

Publishing year: 2019 Thin Solid Films
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation

Publishing year: 2019 ACS Applied Electronic Materials
Electronics Integration and Reliability, Department of Electrical Engineering and Automation, Harri Lipsanen Group, Department of Electronics and Nanoengineering

Atomic layer deposition of piezoelectric aluminum nitride thin films

Publishing year: 2019
Department of Electrical Engineering and Automation, Microfabrication, Department of Chemistry and Materials Science, Electronics Integration and Reliability

Mechanical properties and reliability of aluminum nitride thin films

Publishing year: 2019 Journal of Alloys and Compounds
Electronics Integration and Reliability, Department of Electrical Engineering and Automation, Markku Sopanen Group, Department of Electronics and Nanoengineering

Metalorganic chemical vapor deposition of aluminum nitride on vertical surfaces

Publishing year: 2019 Journal of Crystal Growth
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

The effect of platinum contact metallization on Cu/Sn bonding

Publishing year: 2018 Journal of Materials Science: Materials in Electronics
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding

Publishing year: 2018 IEEE Transactions on Components, Packaging and Manufacturing Technology
Microfabrication, Department of Chemistry and Materials Science, Department of Electronics and Nanoengineering, Department of Electrical Engineering and Automation, Harri Lipsanen Group, Electronics Integration and Reliability

Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma

Publishing year: 2018 JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY A
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Publishing year: 2018 Proceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Stability of Piezoelectric Al1-xScxN Thin Films

Publishing year: 2018