Mervi Paulasto-Kröckel
Professor
Professor
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Honors and awards
Best paper award
Award or honor granted for a specific work
Department of Electrical Engineering and Automation
Oct 2000
JVST A Best ALD Paper Award
Award for paper "Atomic layer deposition of AlN using atomic layer annealing—Towards high-quality AlN on vertical sidewalls, by Elmeri Österlund, Heli Seppänen, Kristina Bespalova, Ville Miikkulainen and Mervi Paulasto-Kröckel, JVST A 39, 032403 (2021)"
Award or honor granted for a specific work
Department of Chemistry and Materials Science
Jun 2021
Research groups
- Electronics Integration and Reliability
Publications
Finite element simulation of solid-liquid interdiffusion bonding process
Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel
2022
IEEE Transactions on Components, Packaging and Manufacturing Technology
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel
2022
Journal of Alloys and Compounds
Joint International Master in Smart Systems Integrated Solutions
Knut E. Aasmundtveit, Changhai Wang, Marta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc Desmulliez, Ferenc Ender, Vesa Vuorinen
2021
Proceedings of Smart Systems Integration Conference, SSI 2021
Characterization of AlScN-Based Multilayer Systems for Piezoelectric Micromachined Ultrasound Transducer (pMUT) Fabrication
Kristina Bespalova, Elmeri österlund, Glenn Ross, Mervi Paulasto-Kröckel, Abhilash Thanniyil Sebastian, Cyril Baby Karuthedath, Stefan Mertin, Tuomas Pensala
2021
Journal of Microelectromechanical Systems
Calculation of Phase Diagrams and First-Principles Study of Germanium Impacts on Phosphorus Distribution in Czochralski Silicon
Hongqun Dong, Xiaoma Tao, Mervi Paulasto-Kröckel
2021
Journal of Electronic Materials
Low-temperature Metal Bonding for Optical Device Packaging
Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2021
Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021
Aluminum Nitride to Silicon Direct Bonding for an Alternative Silicon-On-Insulator Platform
Jani Kaaos, Glenn Ross, Mervi Paulasto-Kröckel
2021
ACS applied materials & interfaces
A humidity-induced novel failure mechanism in power semiconductor diodes
J. Leppänen, G. Ross, V. Vuorinen, J. Ingman, J. Jormanainen, M. Paulasto-Kröckel
2021
Microelectronics Reliability
Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding
Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Kröckel, Tobias Wernicke, Anneliese Pönninger
2021
IEEE Transactions on Components, Packaging and Manufacturing Technology
Wafer Level Solid Liquid Interdiffusion Bonding
V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel
2021
Journal of Electronic Materials