Mervi Paulasto-Kröckel
Professor
Professor
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Email
mervi.paulasto@aalto.fi
Phone number
+358505113197
Honors and awards
JVST A Best ALD Paper Award
Award for paper "Atomic layer deposition of AlN using atomic layer annealing—Towards high-quality AlN on vertical sidewalls, by Elmeri Österlund, Heli Seppänen, Kristina Bespalova, Ville Miikkulainen and Mervi Paulasto-Kröckel, JVST A 39, 032403 (2021)"
Award or honor granted for a specific work
Department of Chemistry and Materials Science
Jun 2021
Best paper award
Award or honor granted for a specific work
Department of Electrical Engineering and Automation
Oct 2000
Research groups
- Electronics Integration and Reliability
Publications
Enhanced Vertical Sidewall Quality for Functional AlN Films in 3D Piezo MEMS Applications
Arsam Ali, Glenn Ross, Mervi Paulasto-Kröckel
2025
Advanced Electronic Materials
Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging
Fahimeh Emadi, Shenyi Liu, Vesa Vuorinen, Mervi Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding
O. Golim, V. Vuorinen, M. Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Early detection of wire bond degradation in IGBT modules using on-chip junction temperature sensor
Joonas Leppanen, Atte Hoffren, Tapio Leppanen, Eeli Kerttula, Shenyi Liu, Vesa Vuorinen, Mervi Paulasto-Kröckel
2025
IEEE Transactions on Power Electronics
Comparison and Optimization of SLID Bonding for Die-attach on Various Substrate Types in Power Module Packaging Applications
Shenyi Liu, Vesa Vuorinen, Jannis Schuh, Jurgen Albrecht, Mervi Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Thermally Conductive Buried Aluminum Nitride for Next Generation Silicon-on-Insulator
Josef Stevanus Matondang, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2025
Advanced Electronic Materials
Cradle-to-Gate Life Cycle Assessment of Si IGBT and SiC MOSFET Power Modules
Mostafa Radwan, Mervi Paulasto-Krockel, Vesa Vuorinen
2025
2025 IEEE Conference on Technologies for Sustainability, SusTech 2025
Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication
Kristina Bespalova, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Advanced Electronic Materials
Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability
Fahimeh Emadi, Vesa Vuorinen, Shenyi Liu, Mervi Paulasto-Krockel
2024
IEEE Transactions on Components, Packaging and Manufacturing Technology
Scaling of piezoelectric in-plane NEMS : Towards nanoscale integration of AlN-based transducer on vertical sidewalls
Artem Gabrelian, Ville Miikkulainen, Glenn Ross, Mervi Paulasto-Kröckel
2024
Materials and Design