Mervi Paulasto-Kröckel

Professor
Professor
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...

Contact information

Phone number
+358505113197

Honors and awards

Best paper award

Award or honor granted for a specific work Department of Electrical Engineering and Automation Oct 2000

JVST A Best ALD Paper Award

Award for paper "Atomic layer deposition of AlN using atomic layer annealing—Towards high-quality AlN on vertical sidewalls, by Elmeri Österlund, Heli Seppänen, Kristina Bespalova, Ville Miikkulainen and Mervi Paulasto-Kröckel, JVST A 39, 032403 (2021)"
Award or honor granted for a specific work Department of Chemistry and Materials Science Jun 2021

Research groups

  • Electronics Integration and Reliability

Publications

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2023 Scripta Materialia

Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope

Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel 2023 Micromachines

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel 2023 IEEE Transactions on Electron Devices

Joint International Master in Smart Systems Integrated Solutions

Knut E. Aasmundtveit, Changhai Wang, Márta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc P.Y. Desmulliez, Ferenc Ender, Vesa Vuorinen 2022 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

F. Emadi, S. Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel 2022 ASDAM 2022 - Proceedings

Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

F. Emadi, V. Vuorinen, S. Mertin, Kim Widell, M. Paulasto-Kröckel 2022 Journal of Alloys and Compounds

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Fahimeh Emadi, Vesa Vuorinen, Mervi Paulasto-Kröckel 2022 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings

Unlocking the Potential of Piezoelectric Films Grown on Vertical Surfaces for Inertial MEMS

Gabrelian Gabrelian, Glenn Ross, Kristina Bespalova, Mervi Paulasto-Kröckel 2022 Materials Today Communications

Finite element simulation of solid-liquid interdiffusion bonding process

Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel 2022 IEEE Transactions on Components, Packaging and Manufacturing Technology