Fahimeh Emadi

Doctoral Researcher
Doctoral Researcher
T410 Dept. Electrical Engineering and Automation
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  • Electronics Integration and Reliability, Doctoral Researcher


Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel 2023 Materials Science and Engineering: A

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

F. Emadi, S. Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel 2022 ASDAM 2022 - Proceedings

Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

F. Emadi, V. Vuorinen, S. Mertin, Kim Widell, M. Paulasto-Kröckel 2022 Journal of Alloys and Compounds

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Fahimeh Emadi, Vesa Vuorinen, Mervi Paulasto-Kröckel 2022 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings

Thermoelectric Characteristics of InAs Nanowire Networks Directly Grown on Flexible Plastic Substrates

Tomi Koskinen, Vladislav Khayrudinov, Fahimeh Emadi, Hua Jiang, Tuomas Haggren, Harri Lipsanen, Ilkka Tittonen 2021 ACS Applied Energy Materials