Vesa Vuorinen
Senior University Lecturer
Senior University Lecturer
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Research groups
- Electronics Integration and Reliability, Senior University Lecturer
Publications
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel
2022
Journal of Alloys and Compounds
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2022
Scripta Materialia
Aluminium corrosion in power semiconductor devices
J. Leppänen, J. Ingman, J. H. Peters, M. Hanf, R. Ross, G. Koopmans, J. Jormanainen, A. Forsström, G. Ross, N. Kaminski, V. Vuorinen
2022
Microelectronics Reliability
Finite element simulation of solid-liquid interdiffusion bonding process
Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel
2022
IEEE Transactions on Components, Packaging and Manufacturing Technology
Joint International Master in Smart Systems Integrated Solutions
Knut E. Aasmundtveit, Changhai Wang, Marta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc Desmulliez, Ferenc Ender, Vesa Vuorinen
2021
Proceedings of Smart Systems Integration Conference, SSI 2021
Low-temperature Metal Bonding for Optical Device Packaging
Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2021
Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021
A humidity-induced novel failure mechanism in power semiconductor diodes
J. Leppänen, G. Ross, V. Vuorinen, J. Ingman, J. Jormanainen, M. Paulasto-Kröckel
2021
Microelectronics Reliability
Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding
Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Kröckel, Tobias Wernicke, Anneliese Pönninger
2021
IEEE Transactions on Components, Packaging and Manufacturing Technology
Wafer Level Solid Liquid Interdiffusion Bonding
V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel
2021
Journal of Electronic Materials
Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding
Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
2020
Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020