Department of Electrical Engineering and Automation
Vesa Vuorinen
Senior University Lecturer
Contact information
Email
[email protected]
Postal address
Tietotie 3
Mobile phone
+358505922899
Full researcher profile
https://research.aalto.fi/...
ORCID
0000-0002-0287-8832
Publications
Department of Electrical Engineering and Automation, Department of Electronics and Nanoengineering, Markku Sopanen Group, Electronics Integration and Reliability
In-situ annealing characterization of atomic-layer-deposited Al2O3 in N2 , H2 and vacuum atmospheres
Publishing year: 2019
Thin Solid Films
Electronics Integration and Reliability, Department of Electrical Engineering and Automation, Microsystems Technology
Inorganic particulate matter in the lung tissue of idiopathic pulmonary fibrosis patients reflects population density and fine particle levels
Publishing year: 2019
ANNALS OF DIAGNOSTIC PATHOLOGY
Power Systems and High Voltage Engineering, Department of Electrical Engineering and Automation, School services, ELEC, Illumination Engineering, Electronics Integration and Reliability, Autonomous Systems, Computational Electromechanics, Industrial and Power Electronics
Development of Working Life Competencies in a Project Course for Master Students at Aalto University
Publishing year: 2019
YLIOPISTOPEDAGOGIIKKA
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation
Publishing year: 2019
ACS Applied Electronic Materials
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS
Publishing year: 2018
Proceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
The effect of platinum contact metallization on Cu/Sn bonding
Publishing year: 2018
Journal of Materials Science: Materials in Electronics
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding
Publishing year: 2018
IEEE Transactions on Components, Packaging and Manufacturing Technology
Department of Electrical Engineering and Automation, Department of Applied Physics, NanoMaterials, Aalto Nanofab, Electronics Integration and Reliability
Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films
Publishing year: 2017
Applied Physics Letters