Vesa Vuorinen

Principal University Lecturer
Principal University Lecturer
T410 Dept. Electrical Engineering and Automation
Full researcher profile

Contact information

Phone number

Research groups

  • Electronics Integration and Reliability, Senior University Lecturer


Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel 2024 Microelectronic Engineering

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel 2023 Materials Science and Engineering: A

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2023 Scripta Materialia

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel 2023 IEEE Transactions on Electron Devices

Joint International Master in Smart Systems Integrated Solutions

Knut E. Aasmundtveit, Changhai Wang, Márta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc P.Y. Desmulliez, Ferenc Ender, Vesa Vuorinen 2022 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

F. Emadi, Shenyi Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel 2022 ASDAM 2022 - Proceedings

Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

F. Emadi, V. Vuorinen, S. Mertin, Kim Widell, M. Paulasto-Kröckel 2022 Journal of Alloys and Compounds

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Fahimeh Emadi, Vesa Vuorinen, Mervi Paulasto-Kröckel 2022 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings

Aluminium corrosion in power semiconductor devices

J. Leppänen, J. Ingman, J. H. Peters, M. Hanf, Robert Ross, G. Koopmans, J. Jormanainen, A. Forsström, G. Ross, N. Kaminski, V. Vuorinen 2022 Microelectronics Reliability