Vesa Vuorinen
Senior University Lecturer
Senior University Lecturer
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Research groups
- Electronics Integration and Reliability, Senior University Lecturer
Publications
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Scripta Materialia
Joint International Master in Smart Systems Integrated Solutions
Knut E. Aasmundtveit, Changhai Wang, Márta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc P.Y. Desmulliez, Ferenc Ender, Vesa Vuorinen
2022
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel
2022
Journal of Alloys and Compounds
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
F. Emadi, S. Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel
2022
ASDAM 2022 - Proceedings
Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer
F. Emadi, V. Vuorinen, S. Mertin, Kim Widell, M. Paulasto-Kröckel
2022
Journal of Alloys and Compounds
Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging
Fahimeh Emadi, Vesa Vuorinen, Mervi Paulasto-Kröckel
2022
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings
Aluminium corrosion in power semiconductor devices
J. Leppänen, J. Ingman, J. H. Peters, M. Hanf, R. Ross, G. Koopmans, J. Jormanainen, A. Forsström, G. Ross, N. Kaminski, V. Vuorinen
2022
Microelectronics Reliability
Finite element simulation of solid-liquid interdiffusion bonding process
Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel
2022
IEEE Transactions on Components, Packaging and Manufacturing Technology
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel
2022
IEEE Transactions on Electron Devices
Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding
Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Kröckel, Tobias Wernicke, Anneliese Pönninger
2022
IEEE Transactions on Components, Packaging and Manufacturing Technology