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Vesa Vuorinen
Department of Electrical Engineering and Automation

Vesa Vuorinen

Senior University Lecturer

Contact information

Postal address
Tietotie 3
Mobile phone
+358505922899
Full researcher profile
https://research.aalto.fi/...

Publications

Department of Electrical Engineering and Automation, Electronics Integration and Reliability

The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation

Publishing year: 2019 ACS Applied Electronic Materials
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Publishing year: 2018 Proceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

The effect of platinum contact metallization on Cu/Sn bonding

Publishing year: 2018 Journal of Materials Science: Materials in Electronics
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding

Publishing year: 2018 IEEE Transactions on Components, Packaging and Manufacturing Technology
Department of Electrical Engineering and Automation, Department of Applied Physics, NanoMaterials, Aalto Nanofab, Electronics Integration and Reliability

Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films

Publishing year: 2017 Applied Physics Letters
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Chemically Stable Atomic-Layer-Deposited Al<sub>2</sub>O<sub>3</sub> Films for Processability

Publishing year: 2017 ACS Omega
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Interfacial void segregation of Cl in Cu-Sn micro-connects

Publishing year: 2017 ELECTRONIC MATERIALS LETTERS
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates

Publishing year: 2017 Journal of Electronic Materials
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Key parameters influencing Cu-Sn interfacial void formation

Publishing year: 2017 Proceedings of the 18th IEEE Electronics Packaging Technology Conference, EPTC 2016
Department of Electrical Engineering and Automation, Microsystems Technology

Thermodynamic-Kinetic method on Microstructural Evolutions in Electronics

Publishing year: 2017 Handbook of Solid State Diffusion