Vesa Vuorinen
Department of Electrical Engineering and Automation

Vesa Vuorinen

Senior University Lecturer

Contact information

Email
[email protected]
Postal address
Tietotie 3
Mobile phone
+358505922899
Full researcher profile
https://research.aalto.fi/...
ORCID
0000-0002-0287-8832

Publications

Department of Electrical Engineering and Automation, Department of Electronics and Nanoengineering, Markku Sopanen Group, Electronics Integration and Reliability

In-situ annealing characterization of atomic-layer-deposited Al2O3 in N2 , H2 and vacuum atmospheres

Publishing year: 2019 Thin Solid Films
Power Systems and High Voltage Engineering, Department of Electrical Engineering and Automation, School services, ELEC, Illumination Engineering, Electronics Integration and Reliability, Autonomous Systems, Computational Electromechanics, Industrial and Power Electronics

Development of Working Life Competencies in a Project Course for Master Students at Aalto University

Publishing year: 2019 YLIOPISTOPEDAGOGIIKKA
Electronics Integration and Reliability, Department of Electrical Engineering and Automation, Microsystems Technology

Inorganic particulate matter in the lung tissue of idiopathic pulmonary fibrosis patients reflects population density and fine particle levels

Publishing year: 2019 ANNALS OF DIAGNOSTIC PATHOLOGY
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation

Publishing year: 2019 ACS Applied Electronic Materials
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

The effect of platinum contact metallization on Cu/Sn bonding

Publishing year: 2018 Journal of Materials Science: Materials in Electronics
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding

Publishing year: 2018 IEEE Transactions on Components, Packaging and Manufacturing Technology
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Publishing year: 2018 Proceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018
Department of Electrical Engineering and Automation, Department of Applied Physics, NanoMaterials, Aalto Nanofab, Electronics Integration and Reliability

Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films

Publishing year: 2017 Applied Physics Letters
Department of Electrical Engineering and Automation, Electronics Integration and Reliability

Chemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability

Publishing year: 2017 ACS Omega
Department of Electrical Engineering and Automation, Microsystems Technology

Thermodynamic-Kinetic method on Microstructural Evolutions in Electronics

Publishing year: 2017 Handbook of Solid State Diffusion