Vesa Vuorinen
Vanhempi yliopistonlehtori
Vanhempi yliopistonlehtori
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Research groups
- Electronics Integration and Reliability, Senior University Lecturer
Publications
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel
2022
Journal of Alloys and Compounds
Finite element simulation of solid-liquid interdiffusion bonding process
Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel
2022
IEEE Transactions on Components, Packaging and Manufacturing Technology
Joint International Master in Smart Systems Integrated Solutions
Knut E. Aasmundtveit, Changhai Wang, Marta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc Desmulliez, Ferenc Ender, Vesa Vuorinen
2021
Proceedings of Smart Systems Integration Conference, SSI 2021
A humidity-induced novel failure mechanism in power semiconductor diodes
J. Leppänen, G. Ross, V. Vuorinen, J. Ingman, J. Jormanainen, M. Paulasto-Kröckel
2021
Microelectronics Reliability
Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding
Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Kröckel, Tobias Wernicke, Anneliese Pönninger
2021
IEEE Transactions on Components, Packaging and Manufacturing Technology
Wafer Level Solid Liquid Interdiffusion Bonding
V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel
2021
Journal of Electronic Materials
Low-temperature Metal Bonding for Optical Device Packaging
Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2021
Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021
Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding
Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
2020
Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
In-situ annealing characterization of atomic-layer-deposited Al2O3 in N2 , H2 and vacuum atmospheres
Mikael Broas, Jori Lemettinen, Timo Sajavaara, Markku Tilli, Vesa Vuorinen, Sami Suihkonen, Mervi Paulasto-Kröckel
2019
Thin Solid Films
Development of Working Life Competencies in a Project Course for Master Students at Aalto University
Robert Millar, Kirsti Keltikangas, Paulo Pinho, Vesa Vuorinen, Pekka Forsman, Anouar Belahcen, Jorma Kyyrä
2019
YLIOPISTOPEDAGOGIIKKA