Vesa Vuorinen

Senior University Lecturer
Senior University Lecturer
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...

Contact information

Phone number
+358505922899

Research groups

  • Electronics Integration and Reliability, Senior University Lecturer

Publications

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2022 Scripta Materialia

Aluminium corrosion in power semiconductor devices

J. Leppänen, J. Ingman, J. H. Peters, M. Hanf, R. Ross, G. Koopmans, J. Jormanainen, A. Forsström, G. Ross, N. Kaminski, V. Vuorinen 2022 Microelectronics Reliability

Finite element simulation of solid-liquid interdiffusion bonding process

Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel 2022 IEEE Transactions on Components, Packaging and Manufacturing Technology

Joint International Master in Smart Systems Integrated Solutions

Knut E. Aasmundtveit, Changhai Wang, Marta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc Desmulliez, Ferenc Ender, Vesa Vuorinen 2021 Proceedings of Smart Systems Integration Conference, SSI 2021

Low-temperature Metal Bonding for Optical Device Packaging

Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel 2021 Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021

A humidity-induced novel failure mechanism in power semiconductor diodes

J. Leppänen, G. Ross, V. Vuorinen, J. Ingman, J. Jormanainen, M. Paulasto-Kröckel 2021 Microelectronics Reliability

Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding

Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Kröckel, Tobias Wernicke, Anneliese Pönninger 2021 IEEE Transactions on Components, Packaging and Manufacturing Technology

Wafer Level Solid Liquid Interdiffusion Bonding

V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel 2021 Journal of Electronic Materials

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger 2020 Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020