Department of Electrical Engineering and Automation
Vesa Vuorinen
Senior University Lecturer
Contact information
Email
[email protected]
Postal address
Tietotie 3
Mobile phone
+358505922899
Full researcher profile
https://research.aalto.fi/...
ORCID
0000-0002-0287-8832
Publications
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation
Publishing year: 2019
ACS Applied Electronic Materials
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS
Publishing year: 2018
Proceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
The effect of platinum contact metallization on Cu/Sn bonding
Publishing year: 2018
Journal of Materials Science: Materials in Electronics
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding
Publishing year: 2018
IEEE Transactions on Components, Packaging and Manufacturing Technology
Department of Electrical Engineering and Automation, Department of Applied Physics, NanoMaterials, Aalto Nanofab, Electronics Integration and Reliability
Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films
Publishing year: 2017
Applied Physics Letters
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
Chemically Stable Atomic-Layer-Deposited Al<sub>2</sub>O<sub>3</sub> Films for Processability
Publishing year: 2017
ACS Omega
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
Interfacial void segregation of Cl in Cu-Sn micro-connects
Publishing year: 2017
ELECTRONIC MATERIALS LETTERS
Department of Electrical Engineering and Automation, Electronics Integration and Reliability
Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates
Publishing year: 2017
Journal of Electronic Materials