Sähkötekniikan ja automaation laitos

Elektroniikan integrointi ja luotettavuus

Elektroniikan integroinnin ja luotettavuuden tutkimus on luonnostaan erittäin monialaista. Tietotaitomme perustuu materiaalitieteeseen ja erityisesti heterogeenisten järjestelmien materiaalien välisten ilmiöiden ymmärtämiseen. Metodologiamme yhdistää mikrorakenteiden vahvan kokeellisen tutkimuksen ja analyysin termodynaamiseen ja termomekaaniseen sekä diffuusiokineettiseen mallintamiseen.
Electronics integration and reliability
State-of-the-Art Facilities
Interconnects

Examples of our recent research from large international Public-Private-Partnership projects currently running are:

PowerizeD is an innovative EU funded project aiming to develop breakthrough technologies of digitized and intelligent power electronics to enable sustainable and resilient energy generation, transmission and applications. https://powerized.eu/index.php

Our group is contributing in PowerizeD with multiple objectives: 

(a) Implementation of high temperature die attach materials in power modules for increased reliability and product durability. 
(b) Assessment of resource efficiency in different power modules and power systems.
(c) Development of high thermal performance compound semiconductor substrate Alternate Silicon on Insulator (A-SOI).

Research to Business (R2B) funding is intended for public research organizations for projects in which research groups and researchers aim to develop their research into new business and to commercialize their research results.

MEMS Modules

Here the group is developing a novel 3D piezoMEMS which is an advance piezoelectric MEMS sensor capable of full 3D motion and sensing. This is enabled by depositing AlN on the vertical and horizontal surfaces of a MEMS element, giving the design fully unhindered 3D-motion.

Future Makers 2023 aim is towards building long-term sustainable renewal and new business models for the Finnish technology industry. The target of our project is to merge two meticulously developed technological platforms within the EILB group – 3D piezoMEMS and solid liquid interdiffusion (SLID) bonding. The focus is on integrating 3D piezoMEMS wafers with through silicon via (TSV) wafers to demonstrate wafer level packaging.

Recent doctoral dissertations from the EILB group include “Development of piezoelectric microelectromechanical systems for multiaxial motion and sensing” by K. Bespalova Development of piezoelectric microelectromechanical systems for multiaxial motion and sensing (aalto.fi) and “Deposition and characterization of aluminum nitride thin films for piezoelectric MEMS” by E. Österlund Deposition and characterization of aluminum nitride thin films for piezoelectric MEMS (aalto.fi).

Our teaching is part of two master’s programs – Automation and Electrical Engineering (AEE) and Joint International Master in Smart Systems Integrated Solutions (SSIs), and includes e.g. the following courses:
•    ELEC-E8712 Design for Reliability
•    ELEC-E8714 Sustainable Electronics
•    ELEC-E8715 Design and Analysis of MEMS
•    ELEC-E8716 Heterogeneous Integration

For more information, please contact:
•    Prof. Mervi Paulasto-Kröckel ([email protected]),
•    Principal University Lecturer, Dr. Vesa Vuorinen ([email protected]), 
•    Academy Research Fellow, Dr. Glenn Ross ([email protected]), or
•    Postdoctoral Fellow, Dr. Nikhilendu Tiwary ([email protected]).

Viimeisimmät julkaisut

Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication

Kristina Bespalova, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel 2024 Advanced Electronic Materials

Recent Advances of VO2 in Sensors and Actuators

Mahmoud Darwish, Yana Zhabura, László Pohl 2024 Nanomaterials

Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects

Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel 2024 Materials Characterization

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel 2024 Microelectronic Engineering

Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces

Tarmo Nieminen, Tomi Koskinen, Vladimir Kornienko, Glenn Ross, Mervi Paulasto-Kröckel 2024 ACS Applied Electronic Materials

Bonding of ceramics to silver-coated titanium—A combined theoretical and experimental study

Vesa Vuorinen, Reijo Kouhia, Mauno Könönen, Jorma K. Kivilahti 2024 Journal of Biomedical Materials Research - Part B Applied Biomaterials

In-Plane AlN-based Actuator: Toward a New Generation of Piezoelectric MEMS

Kristina Bespalova, Tarmo Nieminen, Artem Gabrelian, Glenn Ross, Mervi Paulasto-Kröckel 2023 Advanced Electronic Materials

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel 2023 Materials Science and Engineering: A

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2023 Scripta Materialia

Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope

Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel 2023 Micromachines
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