Micronova

• Micronova is composed of two facilities: M1, a pilot facility operated by VTT, and M2, known as Nanofab, operated by Aalto University and VTT.
• In total, Micronova is the largest research cleanroom in Nordic countries with 2600 m2 of ISO 4–ISO 6 (class 10 – 1000) space.
• Over 380 tools ranging from nanolithography to thin-film deposition and etching processes
• Micronova cleanroom holds the ISO 9001:2015 certification for research and development work and pilot manufacturing for devices for micro-, nano-, photonics and quantum technology applications, wafer processing services, and facility maintenance.
• Micronova’s cleanroom is run by dedicated maintenance, process engineering, quality and cleanroom operations professionals.

Aalto University's facilities at Micronova Nanofab (M2) provide:

• World-class nanofabrication processes for MEMS, photonics and quantum devices
• State-of-the-art EBL nanolithography for 7 nm line-width accuracy for fast design prototyping and ALD tools for novel process development
• Research groups and companies can carry out fast device design prototyping without the need to invest in expensive tool infrastructure.
• Staff training for companies to operate equipment independently, which facilitates critical IP development

VTT's facilities in M1 and M2 provide a pilot line access for IC-compatible processing:

• Dedicated operator services enable high process quality and high-volume throughput for complex devices in MEMS, photonics and quantum
• Pilot production services at VTT supporting up to 200 mm wafer size

Here are the key technologies available for researchers in the Aalto-run M2 section of Micronova. 

For a detailed list of VTT's M1 technologies, see here: https://www.vttresearch.com/en/ourservices/microfabrication-and-piloting

Cleanroom specifications

• Temperature 21 °C ± 0,5 °C
• Relative humidity 45 % ± 5
• Clean bay – Service chase type
• Raised perforated floor
• Subfab with technical support areas

Lithography

• EBL: Two 100 kV EBL systems for up to 150 mm and 200 mm wafers
• Optical: Contact aligner, Maskless aligner Heidelberg MLA-150 with nominal resolution of 1.2 μm.
• Low-kV EBL and automated SEM metrology system for up to 200 mm wafers

Deposition

• Three ALD’s: plasma & thermal processes for nitrides and oxides (e.g. AlN, TiN, NbN, Al₂O₃, TiO₂, HfO₂, SiO₂, ZrO2), some processes available up to 200 mm wafers
• PECVD: nitride and oxide
• Sputters, evaporators: metals (e.g. Al, Ti, Au, Ni, Cu, Cr, Pt), organic materials, some processes available up to 200 mm

Etching

• ICP-RIE’s with F and Cl chemistries, Bosch and cryogenic processes: F processes available up to 200 mm, Cl up to 150mm
• RIE with F chemistry
• Various wet etch processes
• Laser micromachining with fs laser

Diffusion

• Thermal oxidation and related RCA cleaning up to 150 mm wafers
• POCl3 diffusion

Annealing

• RTA and annealing in different atmospheres (N2, N2/H2)

Characterization

• Various characterization tools, including SEM, Micro-Raman, AFM, XRD, FIB/SEM/EDX, spectroscopic ellipsometer, carrier lifetime, several electrical characterization tools

Epitaxy

• Two MOVPE reactors for e.g. GaAs, GaN growth

Plating

• For Cu, Sn and Ni up to 150 mm wafers

Back-end

• Wire bonding, wafer dicing

As a default, processes are available from chips to whole 150 mm wafers but several tools support also 200 mm wafers.

If you work for VTT, Aalto University or an organisation which already has an equipment use agreement with VTT or Aalto, click here:

If you are interested in using Micronova Nanofabrication facilities but have no prior affiliation, please contact the Nanofab manager:

We offer two courses on working in the cleanroom. The Cleanroom user training is mandatory for everyone who wants to work in the Aalto part of the Micronova cleanroom or the other laboratories. The Chemical training is requisite for any kind of chemical work using fume hoods or wet benches.

Micronova
Tietotie 3
02150 Espoo