Vesa Vuorinen
Principal University Lecturer
Principal University Lecturer
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
E-post
vesa.vuorinen@aalto.fi
Telefonnummer
+358505922899
Forskningsgrupp
- Electronics Integration and Reliability, Senior University Lecturer
Publikationer
Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging
Fahimeh Emadi, Shenyi Liu, Vesa Vuorinen, Mervi Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding
O. Golim, V. Vuorinen, M. Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Early detection of wire bond degradation in IGBT modules using on-chip junction temperature sensor
Joonas Leppanen, Atte Hoffren, Tapio Leppanen, Eeli Kerttula, Shenyi Liu, Vesa Vuorinen, Mervi Paulasto-Kröckel
2025
IEEE Transactions on Power Electronics
Comparison and Optimization of SLID Bonding for Die-attach on Various Substrate Types in Power Module Packaging Applications
Shenyi Liu, Vesa Vuorinen, Jannis Schuh, Jurgen Albrecht, Mervi Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Cradle-to-Gate Life Cycle Assessment of Si IGBT and SiC MOSFET Power Modules
Mostafa Radwan, Mervi Paulasto-Krockel, Vesa Vuorinen
2025
2025 IEEE Conference on Technologies for Sustainability, SusTech 2025
Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability
Fahimeh Emadi, Vesa Vuorinen, Shenyi Liu, Mervi Paulasto-Krockel
2024
IEEE Transactions on Components, Packaging and Manufacturing Technology
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Materials Characterization
Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel
2024
Microelectronic Engineering
Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Krockel
2024
IEEE Transactions on Power Electronics
Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
Nikhilendu Tiwary, Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel
2024
2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings