Vesa Vuorinen

Principal University Lecturer
Principal University Lecturer
T410 Dept. Electrical Engineering and Automation
Full researcher profile


[email protected]


  • Electronics Integration and Reliability, Senior University Lecturer


Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects

Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel 2024 Materials Characterization

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel 2024 Microelectronic Engineering

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel 2023 Materials Science and Engineering: A

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2023 Scripta Materialia

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel 2023 IEEE Transactions on Electron Devices

Joint International Master in Smart Systems Integrated Solutions

Knut E. Aasmundtveit, Changhai Wang, Márta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc P.Y. Desmulliez, Ferenc Ender, Vesa Vuorinen 2022 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

F. Emadi, Shenyi Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel 2022 ASDAM 2022 - Proceedings

Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

F. Emadi, V. Vuorinen, S. Mertin, Kim Widell, M. Paulasto-Kröckel 2022 Journal of Alloys and Compounds

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Fahimeh Emadi, Vesa Vuorinen, Mervi Paulasto-Kröckel 2022 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings