Vesa Vuorinen
Principal University Lecturer
Principal University Lecturer
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Sähköposti
vesa.vuorinen@aalto.fi
Puhelinnumero
+358505922899
Tutkimusryhmät
- Electronics Integration and Reliability, Senior University Lecturer
Julkaisut
Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging
Fahimeh Emadi, Shenyi Liu, Vesa Vuorinen, Mervi Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding
O. Golim, V. Vuorinen, M. Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Early detection of wire bond degradation in IGBT modules using on-chip junction temperature sensor
Joonas Leppanen, Atte Hoffren, Tapio Leppanen, Eeli Kerttula, Shenyi Liu, Vesa Vuorinen, Mervi Paulasto-Kröckel
2025
IEEE Transactions on Power Electronics
Comparison and Optimization of SLID Bonding for Die-attach on Various Substrate Types in Power Module Packaging Applications
Shenyi Liu, Vesa Vuorinen, Jannis Schuh, Jurgen Albrecht, Mervi Paulasto-Krockel
2025
IEEE Transactions on Components, Packaging and Manufacturing Technology
Cradle-to-Gate Life Cycle Assessment of Si IGBT and SiC MOSFET Power Modules
Mostafa Radwan, Mervi Paulasto-Krockel, Vesa Vuorinen
2025
2025 IEEE Conference on Technologies for Sustainability, SusTech 2025
Life Cycle Assessment as an Eco-Design Tool in Power Electronics: A Case Study of 1.2 kV Si IGBT vs SiC MOSFET Modules in Motor Drive Inverter
Mostafa Radwan, Hossein Sadegh Lafmejani, Mervi Paulasto-Kröckel, Joonas Leppänen, Vesa Vuorinen, Marko Hinkkanen
2025
2025 Energy Conversion Congress & Expo Europe (ECCE Europe)
Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability
Fahimeh Emadi, Vesa Vuorinen, Shenyi Liu, Mervi Paulasto-Krockel
2024
IEEE Transactions on Components, Packaging and Manufacturing Technology
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Materials Characterization
Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel
2024
Microelectronic Engineering
Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Krockel
2024
IEEE Transactions on Power Electronics