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Mervi Paulasto-Kröckel
Department of Electrical Engineering and Automation

Mervi Paulasto-Kröckel

Professor (Associate Professor)

Contact information

Postal address
Otakaari 7 B
Mobile phone
+358505113197
Full researcher profile
https://research.aalto.fi/...

Honors and awards

Award or honor granted for a specific work
Department of Electrical Engineering and Automation
Oct 2000

Best paper award

Publications

Department of Electrical Engineering and Automation, Microfabrication, Department of Chemistry and Materials Science

Mechanical properties and reliability of aluminum nitride thin films

Publishing year: 2019 Journal of Alloys and Compounds
Department of Electrical Engineering and Automation

The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation

Publishing year: 2019 ACS Applied Electronic Materials
Department of Electrical Engineering and Automation

Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Publishing year: 2018 Proceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018
Department of Electrical Engineering and Automation

The effect of platinum contact metallization on Cu/Sn bonding

Publishing year: 2018 Journal of Materials Science: Materials in Electronics
Department of Electrical Engineering and Automation

Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding

Publishing year: 2018 IEEE Transactions on Components, Packaging and Manufacturing Technology
Department of Electrical Engineering and Automation

Stability of Piezoelectric Al<sub>1-x</sub>Sc<sub>x</sub>N Thin Films

Publishing year: 2018
Microfabrication, Department of Chemistry and Materials Science, Department of Electronics and Nanoengineering, Department of Electrical Engineering and Automation, Harri Lipsanen Group

Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma

Publishing year: 2018 JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY A
Department of Electrical Engineering and Automation, Department of Applied Physics, NanoMaterials, Aalto Nanofab

Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films

Publishing year: 2017 Applied Physics Letters
Department of Electrical Engineering and Automation

Chemically Stable Atomic-Layer-Deposited Al<sub>2</sub>O<sub>3</sub> Films for Processability

Publishing year: 2017 ACS Omega
Department of Electrical Engineering and Automation

Interfacial void segregation of Cl in Cu-Sn micro-connects

Publishing year: 2017 ELECTRONIC MATERIALS LETTERS