Mervi Paulasto-Kröckel

Professor
Professor
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Sähköposti
[email protected]
Puhelinnumero
+358505113197

Palkinnot

JVST A Best ALD Paper Award

Award for paper "Atomic layer deposition of AlN using atomic layer annealing—Towards high-quality AlN on vertical sidewalls, by Elmeri Österlund, Heli Seppänen, Kristina Bespalova, Ville Miikkulainen and Mervi Paulasto-Kröckel, JVST A 39, 032403 (2021)"
Award or honor granted for a specific work Department of Chemistry and Materials Science Jun 2021

Best paper award

Award or honor granted for a specific work Department of Electrical Engineering and Automation Oct 2000

Tutkimusryhmät

  • Electronics Integration and Reliability

Julkaisut

Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication

Kristina Bespalova, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel 2024 Advanced Electronic Materials

Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability

Fahimeh Emadi, Vesa Vuorinen, Shenyi Liu, Mervi Paulasto-Krockel 2024 IEEE Transactions on Components, Packaging and Manufacturing Technology

Scaling of piezoelectric in-plane NEMS : Towards nanoscale integration of AlN-based transducer on vertical sidewalls

Artem Gabrelian, Ville Miikkulainen, Glenn Ross, Mervi Paulasto-Kröckel 2024 Materials and Design

Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects

Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel 2024 Materials Characterization

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel 2024 Microelectronic Engineering

Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Krockel 2024 IEEE Transactions on Power Electronics

Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces

Tarmo Nieminen, Tomi Koskinen, Vladimir Kornienko, Glenn Ross, Mervi Paulasto-Kröckel 2024 ACS Applied Electronic Materials

In-Plane AlN-based Actuator: Toward a New Generation of Piezoelectric MEMS

Kristina Bespalova, Tarmo Nieminen, Artem Gabrelian, Glenn Ross, Mervi Paulasto-Kröckel 2023 Advanced Electronic Materials

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel 2023 Materials Science and Engineering: A

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2023 Scripta Materialia