Defence in the field of Micro and Nanosciences M.Sc. (Tech.) Perttu Sippola
Atomic layer deposition (ALD) technology has become one of the main drivers for miniaturizing integrated circuits and memories. They utilize the intrinsic conformality and nanometer range thickness scaling capability of the ALD thin films for the 3D architectures. Due to these advantages, ALD has also many other applications that it is being applied or could be adopted for more efficient and versatile technology.
This thesis covered studies of ALD aluminum nitride and aluminum oxide/titanium oxide thin films. Particularly the research involved ranging the ALD process factors and analyze the responses to the material growth, composition and properties. The former included for example mechanical, structural and corrosion resistance properties. The obtained results of Al2O3/TiO2 film stack could be used to obtain more efficient films for example to corrosion protection of steel. In the case of the AlN, the research concentrated more on the prosessability and fundamental properties of the films but the studies can be seen to pave a way for example to conformal material depositions for future sensor generations. In general, the thesis can be considered to have technological impact by introducing novel results of prominent and widely recognized ALD processes and materials.
Opponent: Professor Mustafa Alevli, Marmara University, Turkey
Supervisor: Professor Harri Lipsanen, Aalto University School of Electrical Engineering, Department of Electronics and Nanoengineering.