Glenn Ross
Academy Research Fellow
Academy Research Fellow
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
E-post
glenn.ross@aalto.fi
Utmärkelser
Vuoden sytyttäjä - Motivator of the year 2017 - 2018
For excellent and dedicated guidance in advising students' project work.
Award or honor granted for academic or artistic career
Department of Electrical Engineering and Automation
Apr 2018
Top 3 Student Session Winners
Impurities in electroplated Cu and void formation in Cu-Sn micro-connects
Award or honor granted for a specific work
Department of Electrical Engineering and Automation
Jan 2017
Forskningsgrupp
- Electronics Integration and Reliability, Academy Research Fellow
Publikationer
Enhanced Vertical Sidewall Quality for Functional AlN Films in 3D Piezo MEMS Applications
Arsam Ali, Glenn Ross, Mervi Paulasto-Kröckel
2025
Advanced Electronic Materials
Thermally Conductive Buried Aluminum Nitride for Next Generation Silicon-on-Insulator
Josef Stevanus Matondang, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2025
Advanced Electronic Materials
Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication
Kristina Bespalova, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Advanced Electronic Materials
Scaling of piezoelectric in-plane NEMS : Towards nanoscale integration of AlN-based transducer on vertical sidewalls
Artem Gabrelian, Ville Miikkulainen, Glenn Ross, Mervi Paulasto-Kröckel
2024
Materials and Design
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Materials Characterization
Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces
Tarmo Nieminen, Tomi Koskinen, Vladimir Kornienko, Glenn Ross, Mervi Paulasto-Kröckel
2024
ACS Applied Electronic Materials
Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
Nikhilendu Tiwary, Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel
2024
2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings
In-Plane AlN-based Actuator: Toward a New Generation of Piezoelectric MEMS
Kristina Bespalova, Tarmo Nieminen, Artem Gabrelian, Glenn Ross, Mervi Paulasto-Kröckel
2023
Advanced Electronic Materials
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel
2023
Materials Science and Engineering: A
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Scripta Materialia