Aalto and European partners develop an international course in printed and flexible electronics
Initiated through the Unite! Seed Fund, the proposed Erasmus+ Blended Intensive Programme (BIP) responds to the growing demand for specialists in printed and flexible electronics, an emerging field with applications in sensors, wearable systems, and smart packaging.
Aalto will help shape the BIP’s academic content and contribute its expertise in organic electronics to the partnership.
Aalto coordinator, Caterina Soldano, shares the importance of collaboration in this field:
“Printed and flexible electronics spans materials science, electrical engineering, device physics and manufacturing in ways none of us in the PrintElec group can fully cover on our own, thus our international collaboration is fundamental. What makes PrintElec–Unite! particularly exciting is that it combines online theoretical training from experts across four universities with hands-on laboratory work during the on-site part of the programme in Wroclaw, giving students a unique blend of knowledge and practical experience they simply could not get elsewhere.”
The new course is planned to launch in summer 2027.
Stay tuned for this upcoming BIP and plenty of other Unite! opportunities via the Unite! Catalogue for Students or subscribe to the Aalto Unite! Monthly Newsletter for updates.
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