Nikhilendu Tiwary

Staff Scientist
Staff Scientist
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Telefonnummer
+358466138390

Kompetensområde

Forskningsgrupp

  • Electronics Integration and Reliability, Staff Scientist

Publikationer

Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Krockel 2024 IEEE Transactions on Power Electronics

Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration

Nikhilendu Tiwary, Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel 2024 2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2023 Scripta Materialia

Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope

Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel 2023 Micromachines

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel 2023 IEEE Transactions on Electron Devices

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

F. Emadi, Shenyi Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel 2022 ASDAM 2022 - Proceedings

Finite element simulation of solid-liquid interdiffusion bonding process

Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel 2022 IEEE Transactions on Components, Packaging and Manufacturing Technology

Low-temperature Metal Bonding for Optical Device Packaging

Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel 2021 Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021

Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds

Phillip Papatzacos, Nikhilendu Tiwary, Nils Hoivik, Hoang-Vu Nguyen, Avisek Roy, Knut E. Aasmundtveit 2021 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)