Ihmiset

Nikhilendu Tiwary

Staff Scientist

T410 Dept. Electrical Engineering and Automation

Full researcher profile

https://research.aalto.fi/...

Sähköposti

[email protected]

Puhelinnumero

+358466138390

Osaamisalueet

Advanced packaging & reliability, 3D heterogeneous integration, MEMS/NEMS, III/V piezoelectric devices, Semiconductor physics

Tutkimusryhmät

Electronics Integration and Reliability, Staff Scientist

Julkaisut

Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Krockel 2024 IEEE Transactions on Power Electronics

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2023 Scripta Materialia

Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope

Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel 2023 Micromachines

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel 2023 IEEE Transactions on Electron Devices

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

F. Emadi, Shenyi Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel 2022 ASDAM 2022 - Proceedings

Finite element simulation of solid-liquid interdiffusion bonding process

Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel 2022 IEEE Transactions on Components, Packaging and Manufacturing Technology

Low-temperature Metal Bonding for Optical Device Packaging

Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel 2021 Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021

Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds

Phillip Papatzacos, Nikhilendu Tiwary, Nils Hoivik, Hoang-Vu Nguyen, Avisek Roy, Knut E. Aasmundtveit 2021 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)