Smart miniaturized systems in demanding applications from biological and medical to power, optical and automotive electronics are based on sensing and actuation by micro- and nanoelectromechancial systems (MEMS/NEMS). While currently MEMS functional elements are made of silicon, the diversification of applications, demand for new functionalities and higher integration density. This coupled with the requirement of low power consumption provides an opportunity to explore new and innovative integration strategies in the design of MEMS, BioMEMS and MOEMS, including the utilization of new materials and interfaces. The research of Electronics Integration and Reliability group is focused on new hybrid and multi-material concepts for smart system integration in applications such as, Internet of Things, Smart energy, mobility and health related applications. In addition, their implications on device performance, process integration, stress management and reliability is studied.
Electronics Integration and Reliability group belongs to the Department of Electrical Engineering and Automation at Aalto University School of Electrical Engineering. The group is located in Micronova (www.micronova.fi) and uses the cutting-edge infrastructure of OtaNano, established in 2013, providing centralized access to advanced nanofabrication, nanomicroscopy and low-noise measurement facilities. The group is also using different modeling tools to anticipate and rationalize reliability performance of heterogeneous integration in micro- and nanosystems.
Department of Electrical Engineering and Automation is looking to fill two postdoctoral researcher positions and one doctoral candidate position to develop 3D integrated miniaturized smart systems. The work supports a number of recently granted ECSEL JU projects addressing safe autonomous driving, heterogeneous integration of MEMS and silicon-based power electronic components and systems:
- Post-doctoral position in material mechanics modellingof integrated Smart Systems
- Post-doctoral position in thin-film processing and design of Three-Dimensional (3D) Integration of MEMS and Smart Systems
- Doctoral student position in development of Solid-liquid interdiffusion (SLID) bonding
The appointment is available immediately. All positions are fixed-term and filled initially for 1 year, the post-doc positions with an option for an extension of 3-years and the doctoral student position until the end of the 4-year PhD studies. The salary is determined according to the salary system of Aalto University. Employment includes occupational health and social security benefits.
1. Post-doctoral position in material mechanics modelling of integrated Smart Systems
With an innovative combination of advanced thin film processes, the goal is to develop novel micro/nanofabrication based packaging platforms to enable integration of wide variety of heterogeneous technologies including MEMS, BioMEMS, MOEMS and different IC technologies. Process integration often includes the use of multilayer thin-film stacks with vastly different thermomechanical behavior. The interactions between materials require careful consideration of both the thermomechanical and residual stress behavior and to be able to carry out multi-scale thermomechanical modeling and stress management to address the thin film vs component level stresses. Specific emphasis will be placed on Finite Element Modeling (FEM), especially developing and optimizing the material models for thin-film structures under variety of intrinsic and extrinsic stresses.
A candidate should have a doctoral degree with a strong background in material mechanics of electronic materials and extensive experience in FE modelling software. In particular, experience is valued in correlating and optimizing the FE models based on experimental data. You have good knowledge in MEMS and semiconductor technologies and practical experience in related multi-mechanics of materials and systems. Fluency in English both written and spoken is essential.
2. Post-doctoral position in thin-film processing and design of Three-Dimensional (3D) Integration of MEMS and Smart Systems
By combining the state-of-the-art technologies such as wafer bonding, vertical vias and micro-connects, the goal is to develop novel micro/nanofabrication based packaging platforms, for example piezo-electric smart sensors and actuators, and to enable integration of wide variety of heterogeneous technologies including MEMS, BioMEMS, MOEMS and different IC technologies.
A candidate should have a doctoral degree with a strong experimental background in micro and nanofabrication or a related discipline. You have good knowledge in MEMS and semiconductor design and manufacturing technologies and proven practical experience in cleanroom equipment and processes. Knowledge in process integration of multi-material structures is valued. The candidate should have strong analytical and writing skills, and experience or genuine interest on MEMS/NEMS and ubiquitous smart systems. Fluency in English both written and spoken is a requirement.
3. Doctoral student position in development of Solid-liquid interdiffusion (SLID) bonding
The goal is to develop novel micro/nanofabrication based packaging platforms to enable integration of a wide variety of heterogeneous technologies by utilizing advanced thin film processes. One key enabling technique for heterogeneous integration is Solid-liquid interdiffusion (SLID) bonding that allows for multi-wafer stacking. In addition, to mitigate the effects of high processing temperatures on device functionality and reliability, novel material solutions are being developed in order to achieve low-temperature SLID bonding.
A candidate should have a M.Sc. or equivalent degree in a suitable area (e.g. electrical engineering, micro/nanoelectronics, physics or materials science), or be a M.Sc. student in a final phase of his/her studies. The candidate should have strong analytical and writing skills, and experience or genuine interest on MEMS/NEMS and smart systems. Expertise in micro/nanofabrication processes and material characterization methods is valued. Fluency in English both written and spoken is a requirement.
How to apply
To apply, submit the documents indicated below using the on-line recruitment system link ‘Apply now!’, by May 31st , 2019. Application materials should be submitted in a single pdf file and in English.
Your application should include the following attachments: motivation letter, CV, a copy of study records, list of publications and names and contact details of 2 references. Please indicate in your motivation letter which position you are applying.
For additional information in recruitment process related questions, please contact HR Coordinator Jaana Hänninen, [email protected].
Aalto University reserves the right for justified reasons to leave the position open, to extend the application period and to consider candidates who have not submitted applications during the application period.
Aalto University is a community of bold thinkers where science and art meet technology and business. We are committed to identifying and solving grand societal challenges and building an innovative future. Aalto has six schools with nearly 11 000 students and a staff of more than 4000, of which 400 are professors. Our campuses are located in Espoo and Helsinki, Finland.
The School of Electrical Engineering is one of the six schools of Aalto University. Our portfolio covers fields from natural sciences to engineering and information sciences. In parallel with basic research, we develop ideas and technologies further into innovations and services. We are experts in systems science; we develop integrated solutions from care of the elderly to space robotics. The School is an international unit with close to 60 professors and 2 000 full-time students, including over 200 doctoral students.