Services

LTL - Bonder (Delvotec 5430)

General Information

  • Device: Delvotec 5430 Bonder
  • Specifications

Contact Person: Alexander Savin
Location: Nanotalo, room 170b

Tutorial

Bonding using a predefined program

  • Initializing

  1. Switch power on
  2. Press home
  3. Press read to load a program from the memory. There is a list of all the programs in a notebook titled Delvotec 5430.
  4. Use  and  to select the program number
  5. Press enter to load the program
  6. Press bond to move to starting position
  • Bonding loop

  1. Move the sample so that you are approximately on top of the first bonding pad
  2. Press bond to move to programmed starting height
  3. Finetune the sample position (at this point it's best to use the left-hand controller)
  4. You can use up and down to control the height (the used height is set up as the new starting height when you press bond)
  5. Press bond to bond the wire and move to the end position
  6. Move the sample so that you are approximately on top of the second bonding pad
  7. Press bond to move to programmed end height
  8. You can use up and down to control the height (the used height is set up as the new end height when you press bond)
  9. Press bond to bond the wire, cut it and move to starting position)

Creating a new program

Description of the procedure can be found in the manual. The simplest way is to modify old program and save it under new name.

Low Temperature Laboratory / bonder5430
Bonder (Delvotec 5430)
Low temperature laboratory / Nanotalo, room 170b
Nanotalo, room 170b
This service is provided by:

Low Temperature Laboratory

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